ECTC 2023
ASMPT 邀请您与我们一起参加在 5 月 30 日至 6 月 2 日举办的 ECTC 2023，地点为佛罗里达州奥兰多 JW 万豪酒店。ECTC 是在合作环境和技术交流中提供一流封装、元件、微电子系统科学、技术和教育的全球顶尖活动。
欢迎莅临我们的展位 #237，与 ASMPT NEXX 和 ASMPT AMICRA 的专家会面。
ASMPT 在技术会议上撰写了4个主题：
May 31 (Wed), Session 3 & Session 4
- Direct Die to Wafer Cu Hybrid Bonding for Volume Production
- by ASMPT SEMI (Fan Chun Ho, Ng Hoi Ping, So Siu Cheung, Dr. Li Ming, Lau Siu Wing, Thomas Uhrmann, Juergen Burggraf, Mariana Pires)
- A Methodology to Optimize Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- co-authored by ASMPT ALSI (Roman Doll, Kees Biesheuvel, Faysal Boughorbel, Jeroen Van Borkulo, Mark Mueller) & IBM Research
Jun 1 (Thu), Session 13 & Session 19
- Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film™
- co-authored by ASMPT (Dr. Li Ming) & Unimicron Technology Corp.
- Voids-Free Die-Level Cu/ILD Hybrid Bonding
- co-authored by ASMPT (Roy Yu, John Knickerbocker, Dale McHerron, Dr. Li Ming, So Siu Cheung, Kwok So Ying, Fan Chun Ho, Lau Siu Wing) & IBM Research
关于 ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
